Mold flow analysis software is best used to avoid processing problems, by
optimizing gate locations, balancing runner systems or determining molding
machine tonnage requirements. Also, the software can be used to problem solve,
such as short shot or gas trap conditions, material degradation issues, or
minimize material usage in a cold runner system. More advanced mold flow
capabilities include cooling and warpage analysis. With a cooling analysis
several different aspects of the cooling system can be evaluated. With warpage
analysis, investigating the magnitude and location of deflections as well as
the cause of warpage can be done. Warpage analysis software breaks down the
cause of warpage into differential shrinkage, cooling, or orientation
effects. This can help in solving warpage issues.
