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Molding for metallization

Good metallization starts with the design of the mold. Many visual defects can be avoided with proper mold design.

The following guidelines should be followed.
- Gates and parting lines should be put in non-appearance areas
- Integral parts should be used to avoid welded joints
- Ribs and bosses should be designed to eliminate sink marks
- Texturing can be used to break up large flat surfaces and hide any defects, such as scratches
- The mold should be designed with generous release angles to avoid the use of mold release agents, which generally have a negative effect on adhesion. Silicon-type mold releases are difficult to remove in a cleaning operation. If it is essential to use a mold release, a stearate or soap type can be chosen.
- Wall thicknesses should be sufficient to ensure rigidity
- In the case of electrolytic plating, the plating uniformity, is a result of the current density distribution, and must be considered in the initial design. Do not use right angles or V-grooves, keep letters close to the surface, make angles as large as possible, and crown large flat surfaces.
- The mold must be highly polished.

Molding recommendations
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Furthermore, the following recommendations for molding conditions can be given.
- The plastic should be properly dried before molding to avoid splay or delamination on the part, which may result in blistering.
- The temperature of the melt should be sufficiently high as to avoid molded-in stresses, which could cause uneven etching in electroless plating or lead to cracking if swelling in a solvent is applied.
- Too fast a fill speed can overpack the mold, making the part surface harder to etch and may result in a loss of adhesion.

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