T-CONN, one of the major local connector manufacturer in Taiwan, has selected Stanyl® ForTii™ as the halogen-free housing material for its wide range of battery connectors. Stanyl Fortii not only meets the stringent material requirements of SMT soldering technology, it also offers outstanding performance in dimensional stability, full compliance to JEDEC MSL level 2, high toughness and extreme pin retention forces. As a result, Stanyl ForTii leads to a significant reliability improvement versus LCPs (Liquid Crystal Polymers) and to better processing compared to PPAs. Following the approval in battery connectors, T-CONN has started to expand the usage of Stanyl ForTii also to their FPC product line.
Andy Chen - Product Manager of T-CONN in Taiwan says: “We selected Stanyl ForTii for our latest halogen free, UL94-V0 compliant battery and FPC connectors to the Notebook panel, because its excellent thermal and mechanical properties improve previous LCP performance in terms of brittleness or weld line strengths. With Stanyl ForTii we can support major Notebook manufacturer in Taiwan with a reliable halogen free solution that meets highest requirements of dimensional stability and toughness.” Mr Chen adds: “Our new battery and FPC connectors made with Stanyl ForTii have already been approved by one of the top four Notebook manufacturer. We are convinced that the performance improvement of our solution will quickly gives us further market penetration. Together with DSM we are able to support the electronics industry in its ambition towards halogen free Computers.”
Aaron Lin, Business Development Manager Greater China, who worked with T-CONN, comments : “With Stanyl ForTii we could support T-CONN not only with a great halogen free high temperature polyamide, but in addition we were able to contribute to a further performance improvement and increased reliability during removal cycles of battery packs and in demanding drop tests of notebooks and netbooks.”
Allen Chen, Regional Manager Stanyl ForTii in Asia, adds: “Changing the housing material to Stanyl ForTii leads to less cracking thanks to its outstanding weld line strength and toughness compared to LCPs.The easy processing of Stanyl ForTii and highest flow amongst competitive halogen free PPAs makes the material an ideal drop-in solution for T-CONN.”
Since its initial market launch in April 2008, Stanyl ForTii has seen a broad market penetration and is approved by many customers for various challenging applications that require a blister resistant material with high dimensional stability and high thermal and mechanical performance. More details can be found under www.ForTii.com.
