Royal DSM N.V. today announces the development of a new polymer which extends
the portfolio for high performance engineering thermoplastics. The polymer,
described as PA4T, has been developed by DSM Engineering Plastics, the
inventor and global market leader in high performance polyamides with Stanyl®.
The new polymer will answer to market trends for miniaturization and
convergence of electronic devices like cell phones and computers. It will
assist automakers in continued weight reduction efforts for better fuel
efficiency and lower costs. PA4T exhibits an exciting and unique balance of
properties including excellent dimensional stability, compatibility with lead
free soldering, high stiffness and mechanical strength at elevated
temperatures, high melting point, and excellent processability in terms of
flow and processing window.
Nico Gerardu, member of DSM’s Managing Board and responsible for the
Performance Materials cluster, is proud of the invention: “It is very special
that DSM introduces a new polymer to the market. Polymers started to enter the
materials arena at the beginning of the 20th century, around the time that DSM
was born. Most of the polymers used today were introduced to the market in the
‘30’s till ‘60’s. After 1980 very few new polymers were introduced. PA4T is
the first new polymer to be introduced in the new millennium – which is a true
achievement of our research and business people and a true commitment to
innovation. This breakthrough innovation fits perfectly with the acceleration
of DSM’s strategy Vision 2010 – Building on Strengths as announced today,
which involves a strong focus on Life Sciences and Materials Sciences.”
DSM envisions that PA4T materials are highly suitable for electronics
applications such as memory card connectors, CPU sockets, high temperature
bobbins, and notebook computer memory module connectors, based on its
excellent compatibility in lead free surface mount technology and dimensional
stability. In automotive markets, DSM expects the material to support new
developments in under the hood applications relating to automotive electrical
systems, fuel delivery, and cooling components.
DSM has filed patents on the new polymer, developed compounds and held initial
investigative trials with market leaders for various end uses. Results to date
have been impressive and DSM is currently constructing a market development
plant at the Chemelot site in Sittard-Geleen, the Netherlands, which will
provide quantities of the polymer for pre-marketing. The market development
plant will become operational in the first quarter 2008.
“This is an exciting opportunity for DSM Engineering Plastics and for
our customers, who are being driven for higher performance in their
applications and lower system costs delivered to their customers. PA4T is a
promising complementary product in our portfolio. This development will
support green initiatives such as lead free soldering and improved fuel
economy. We are committed to moving as quickly as possible to bring this new
material, which addresses these needs, to the market and to extend the number
of applications where high performance polyamides can be effective,"
comments Roelof Westerbeek, Global Business Director High Performance
Polyamides at DSM Engineering Plastics.
