DSM Engineering Plastics has unveiled the trade name under which it is to
launch its latest high performance polymer for use in electronics and other
applications. At a special naming ceremony today in Sittard, The Netherlands,
the global leader in high temperature polyamides announced that the new
polymer will be known as Stanyl® ForTii™. Key customers from
various industries in the US, Europe and Asia have been involved in the naming
process.
A unique balance of properties
As part of the
Stanyl family, ForTii (previously announced as PA4T) is a totally new
halogen free, flame retardant, high temperature polyamide which extends the
portfolio for high performance engineering thermoplastics. Stanyl ForTii
offers a step-change with a unique balance of properties to meet today’s need
for smart innovation. The properties mix includes excellent dimensional
stability, compatibility with lead free reflow soldering, highest stiffness
and mechanical strength at extreme temperatures. Due to its broad processing
window and high flow, Stanyl ForTii has excellent processability. In proven
customer applications, the balance of dimensional stability, high mechanical
and thermal performance and exceptionally low moisture uptake outpaces those
of existing polymers.
Stanyl ForTii: meeting market needs and offering customer value
New Stanyl ForTii joins the outstanding range of Stanyl products and meets
market needs for lead free soldered surface mount devices such as circuit
boards used in personal computers, as well as the current move towards halogen
free electronics. It facilitates the ongoing trend towards further
miniaturization, higher data transfer rates and convergence of electronic
devices like cell phones, GPS navigators and computers. It will also assist
automakers and the aerospace industry in continued weight reduction efforts
for better fuel efficiency and lower costs.
Business Group Director of DSM Engineering Plastics Roelof Westerbeek says:
“Thanks to its high melting point, extreme stiffness over a wide temperature
range and high glass transition point, ForTii is like a diamond in the world
of plastics. Its unique balance of characteristics make it highly suitable for
electronics applications such as memory card connectors or notebook computer
memory module connectors where today’s materials such as LCPs increasingly
face warpage issues. In automotive markets, the material will be able to
support new developments in under the hood applications for automotive
electrical systems, air/fuel and powertrain components. In the lighting
industry, customer trials have revealed an excellent fit for housing and
modules of LEDs due to high reflectivity and highest temperature stability.”
Excellent progress
Following successful initial trials with
customers, DSM Engineering Plastics opened a market development plant in the
Netherlands in 2008. This has provided significant quantities of the polymer
for pre-marketing. Customer trials have been extended, with continued positive
results and various full functional and commercial customer approvals.
Roelof Westerbeek: “We are making excellent progress and are well on schedule
in bringing Stanyl ForTii to the market and to extend the number of
applications where high performance polyamides can be effective.” He adds:
“Stanyl ForTii will provide customers with the opportunity to re-consider
their designs and material choices, effectively replacing other materials such
as LCP. It expands the application range of Stanyl to applications with
surface mount technology and will help customers to achieve higher performance
in their applications and meet current and upcoming requirements of original
equipment manufacturer. With an entirely halogen free portfolio, this
development will support green initiatives such as lead free soldering and
improved fuel economy.”
