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Unique combination of properties from DSM Engineering Plastics: Stanyl® ForTii™ for SSD high speed SATA 6GB/S
Sittard,The Netherlands,23 Jul 2009

Solid State Disk Drives (SSDs) are currently experiencing strong market growth as they contribute to higher data reliability, lower weight and noise, faster access times and power reduction.

Serial Advanced Technology Attachment (SATA) and Serial Attached SCSI (SAS) are set to be the dominant interfaces to interconnect SSDs to e.g. Notebooks or the strongly growing Netbooks. In these applications, Stanyl® ForTii™ provides an excellent halogen free, flame retardant solution.

Among the unique properties of halogen-free V-0 Stanyl ForTii are high strength before and after reflow process, which leads to significantly higher pin retention values than for LCPs, an outstanding toughness and stiffness, and proven lower corrosion on molding equipment compared with competitive PPAs. Stanyl ForTii is also the material of choice for hard disk or hybrid drives and can be used both on the device and PCB side.

Molex
For its latest range of SAS and SATA connectors, Molex, a leading supplier of interconnect products, was looking for a halogen-free (HF) insulation material that would meet the material requirements for SMT technology. As part of its halogen free material selection, the company successfully tested the F11 grade of Stanyl ForTii for its latest high speed SATA connector with a speed of 6Gb/s, because it offered the highest pin retention forces, as well as a range of key processing and performance benefits.

Stanyl ForTii extends the DSM portfolio of high performance engineering thermoplastics. Stanyl ForTii offers a step-change with a balance of properties to meet today’s need for smart innovation. Stanyl ForTii extends the application range of current Stanyl products and helps customers to achieve higher performance in their applications and meet current and upcoming requirements of OEMs, supporting green initiatives such as lead free soldering and improved fuel economy.

John McMullan, Global Key Account Manager Molex at DSM Engineering Plastics Americas says: ”Stanyl ForTii meets market trends for miniaturization and convergence of electronic devices like cell phones and computers. It is suitable for connectors and sockets in these applications because of its dimensional stability and compatibility in lead free surface mount assembly processes.”

Siang-Hock Quah, Regional Manager South East Asia at DSM Engineering Plastics says: “Stanyl ForTii gives customers like Molex new design and material choices. Based on years of molding and application experience, we are glad to see a material which is so balanced and can be used for so many different applications. Together with our strong capability in Computer Aided Design and intense application support, ForTii enables customers to realize first time design rights and boost time to market. In specific in the current conversion to halogen free, we see customers trialing various materials with repeated adjustments in the processing. Stanyl ForTii can help to save valuable time.”

Recently, DSM Engineering Plastics has announced that, in order to meet high market demand, the company will significantly expand production capacity of Stanyl ForTii.

For more information
Thea Trilsbeek
+31 46 477 3176
Media-Europe.DEP@dsm.com
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