DSM Engineering Plastics has introduced a new grade of Xantar LDS PC/ABS
suitable for Laser Direct Structuring (LDS) applications. Xantar LDS 3710 was
developed for antennas in mobile telecom products such as telephones, PDAs and
other applications where integrated circuitry is used to replace traditional
printed circuit boards.
A key application for Xantar LDS 3710 is the GSM antenna for a mobile phone.
Produced by Molex, a leading supplier of interconnect products, this is the
first time DSM’s PC/ABS based LDS technology is used for the production of a
mobile phone antenna.
The antenna function is made by means of Laser Direct Structuring on a moulded
part. LDS is a simple and precise technology for producing 3D molded
interconnect devices. After molding, the interconnect pattern is directly
written on the part and the conductive paths are plated where the plastic has
been activated by the laser. The part is subsequently fixed in the housing of
the mobile phone.
Laser Direct Structuring offers flexibility, real 3D shaped circuitry on a
plastic moulded part and design freedom. Xantar LDS 3710 provides excellent
plating properties, excellent ductility/high impact performance (it passes the
usual mechanical tests for mobile phones) and surface appearance. Overall
Xantar LDS 3710 outperforms alternative materials in both ductility and/or
surface appearance.
Molex is leading supplier of connectors and is well-known for developing
products for portable digital product applications. According to Andreas Eder,
Engineering Manager at the Molex Antenna Business Unit, Xantar LDS 3710
provided an excellent and cost-effective solution. Mr Eder added: “We were
particularly impressed by DSM’s service to support customers in applying new
materials and technologies such as these.”
