Yparex® adhesive tie-layer resins for extrusion

The Yparex range provides outstanding adhesion for all forms of polyethylene including cross-linked PE to
• barrier plastics like EVOH and Polyamide
• metals like aluminium, steel and copper.

Yparex offers
• Rheology tailored for your extrusion process
• Consistent products regarding flow and melt stability
• Maintains adhesion to metals up to 95°C

The bonding that Yparex provides between polyethylene and the other layers develops in the melt phase and depends on contact time and temperature

Film applications

Multi-layer barrier films for food applications with low oxygen permeation
Industrial films with oxygen barrier
Multi-layer non-food packaging for improved mechanical properties and puncture resistance

Pipe applications

Multi-layer barrier pipes for floor heating, protective pipes for cables etc
Multi-layer composite pipes (metal/plastic) for 100% diffusion tight pipes that are corrosion resistant and function up to 95°C

Barrier Food Packaging

Food Compliance

The composition of Yparex grades comply with EC Commission Directive 90/128/EEC section A, including 7 amendments. For the USA, listed Yparex grades comply with USA-FDA part 21 CFR 175 (adhesives and resins).

More specific information can be obtained from your DSM engineer.

Processing

Yparex resins are typically based on PE used for extrusion applications. Most grades have typical melt flow values between 2 .0 and 4.0. Depending on the demands of the application or technology used, higher melt flow values are available, e.g. for extrusion coating and powder coating. Yparex processes similar to the base resin used in each particular grade. Recommended melt temperatures are 210 to 280°C.

Brochure downloads

Click on the images below to download information about Yparex

Yparex is available in Europe

Yparex has limited availablity in USA and Asia.

Further information on Yparex products is available from your local office or mail
using the link below

Yparex® is a registered tradename of Royal DSM.

Mail for Further information