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Stanyl® meets low warpage challenge

For long thin-walled connectors or connectors with demanding coplanarity requirements, e.g. CPU sockets, the insulator resin should allow parts to be molded within tight tolerances. If the material causes the connector body to warp, reject rates will rise.

Stanyl® is able to meet this challenge through a combination of special low warp, easy processing materials and the support of skilled staff that can optimise designs to minimise warpage when using Stanyl®. Low warp Stanyl® grades give performance at a level similar to LCP. The charts below show how warpage is measured and results achieved.

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Flow benefits

Moisture absorption

Moisture analysis

Solder predrying

Connector strength

Connector warpage

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