Electronics

Connectors

Stanyl® offers innovative solutions for advanced electronic connectors components like memory connectors (DDR-DIMM, DDR2), I/O Connectors, board to board and board-to-wire connectors, FPC and FFC connectors (low form factor and pitch down to below 0.4mm), modular jacks, and micro switches.

Stanyl meets the key technological challenges of today’s advanced connector designs:

  • Increasing pin densities, longer connectors, thinner walls, finer pitches
  • Transition to lead-free soldering, consequences of higher solder temperatures
  • Higher productivity and total cost-down solutions
  • Reduced environmental impact (heavy metals)

Stanyl responds to these challenges, and solves issues like:

  • Higher reliability and lower reject rates
  • Enabling innovation for improved connector functionality
  • Stanyl is the leading material to solve today's challenges
  • Reducing waste, scrap and connector failure in connector manufacture and use at all stages
  • Providing system cost advantages compared to other high heat resins
  • Meeting lead-free solder requirements, the industry's material of choice 

 

 

Stanyl is the most suitable resin for advanced electronic connectors delivering:

  • high mechanical strength to > 230°C
  • ductility and weld line strength to reduce breakout
  • unmatched creep resistance for superior pin retention
  • HDT > 280°C to withstand lead-free soldering
  • stable dielectric performance at high frequencies; almost independent of conditions (temperature and humidity) - predictable to work with
  • predictable and controllable blistering

Stanyl delivers value added solutions for major industry concerns including:

Read more in the special Stanyl Highflow brochure

Related Links
Connector blistering
Lead free connectors
Flow benefits
Moisture absorption
Moisture analysis
Solder predrying
Connector strength
Connector warpage
Moisture barrier bags


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