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Providing solutions in Electronic Applications

Stanyl, the perfect match for electronics components. Stanyl is widely used for computer, telecoms, mobile phones components and others due to its easy processing and high performance.

Typical components are memory connectors (DDR-DIMM, DDR2), I/O Connectors, board to board and board-to-wire connectors, FPC and FFC connectors (low form factor and pitch down to below 0.4mm), modular jacks, micro switches.


Stanyl has:

  • Temperature resistance up to 280°C for soldering (IR and lead free)
  • Exceptional flow properties, with high weld line strength, for more robust and reliable connectors than with LCP’s or PPA’s
  • Very high pin retention strength
  • Thinner walls, with no compromise in strength
  • Very high stiffness with very low creep
  • Very high toughness. Connectors made of Stanyl can withstand the high part assembly forces
  • High safety standards - UL 94 certified fully conforming to stringent flammability requirements of the industry.

Stanyl® is a registered trademark of Royal DSM N.V.

Low Cost, High Performance: Easy Processing, Faster Cycle times, Material Savings

Stanyl flows easily and parts can have longer and thinner walls without showing flash.

Mold heating using costly oil and / or electrically heated molds is not required for Stanyl and offer faster cooling times for increased productivity.

Stanyl solutions bring productivity gains.

Stanyl engineers have knowledge of your application support your developments in design and manufacturing to achieve real cost benefits.

Product data


Quick links

Connector blistering

Lead free connectors

Flow benefits

Moisture absorption

Moisture analysis

Solder predrying

Connector strength

Connector warpage

Connector JEDEC standards

Moisture barrier bags


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Application database