Innovations

Stanyl ForTii

As part of the Stanyl® family, ForTii™ is a new high temperature polyamide that extends the portfolio for high performance engineering thermoplastics. It offers a unique balance of properties including excellent dimensional stability, compatibility with lead free soldering, high stiffness and mechanical strength at elevated temperatures, high melting point, and excellent processability in terms of flow and processing window.

Meeting market needs and offering customer value
New Stanyl ForTii meets market trends for miniaturization and convergence of electronic devices like cell phones and computers. It will assist automakers in continued weight reduction efforts for better fuel efficiency and lower costs.

It is highly suitable for electronics applications such as memory card connectors, CPU sockets, high temperature bobbins, switches or notebook computer memory module connectors, based on its excellent compatibility in lead free surface mount technology and dimensional stability.

In automotive markets, the material will be able to support new developments in under-the-hood applications for automotive electrical systems, air/fuel and powertrain components. In the lighting industry, customer trails have revealed an excellent fit to the reflector and housings of LEDs due to high reflectivity and high temperature stability.

Discover Stanyl ForTii further.