Laser Direct Structuring (LDS)

Innovative LDS technology

With molded interconnection device (MID) technologies electronic circuits can be created on 3D parts. The innovative LPKF-LDS™ technology gives higher flexibility compared to other MID technologies, providing faster time to market.

Only three process steps – molding, laser processing and metallization
Simple laser programming changes enable fast development cycles, fine tuning and optional product offerings
Single material – two-shot molding not required, reducing tool cost & molding cycle and material inventory
Integration of 3D shape and electrical connection
Suitable for small and large surface areas

Miniaturization and convergence are major trends in electronics. LDS technology allows smaller designs with integrated functionalities. Small pitch components require reflow soldering and must be heat resistant. With its unique properties Stanyl® ForTii™ LDS grades are compatible with lead-free soldering profile temperatures.

Integrated functionalities

The most benefit for high temperature LDS designs can be obtained when various functions are integrated and miniaturized. The plated areas can have multiple, combined and mixed functions:

Electronic or electrical conductive tracks
Thermal management by tracks or surfaces
Mechanical functions by plated areas
Visible queues & aesthetics - ex: operational symbols & logos

Read more in our published article 'Integrated Functionality in High-Temperature LDS Assemblies'.

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Stanyl® ForTii™ in LDS applications

Stanyl ForTii is the best balanced material

In applications where high temperature (reflow) and mechanical performance are required, Stanyl ForTii is the best balanced material on the market.

Processing

Their are various steps involved in the manufacturing of LDS parts. Across all of these intermediate process steps, Stanyl ForTii performs extremely well.

Good molding (small parts and high flow)
Large process window for lasering
Easy plating (high plating index)
High adhesion (peel strength)

Cases

Overview of LDS cases

Partnership

DSM works with several partners to cover all LDS involved disciplines.