Stanyl® ForTii™ offers a step-change with a unique balance of properties to meet today’s need for smart innovation. The property mix includes excellent dimensional stability, compatibility with lead free reflow soldering, highest stiffness and mechanical strength at extreme temperatures. Stanyl ForTii has excellent processability in terms of flow and processing window. In proven customer applications, the balance of exceptionally low moisture uptake, dimensional stability, high mechanical and thermal performance outpaces those of existing polymers.

Improved performance

• High melting point (325°C)
• High HDT
• High CTI
• Low CLTE
• No blistering @ up to JEDEC MSL 1 levels

Dimensional stability

• High co-planarity / low warpage
• Low moisture uptake
• High stiffness
• Low thermal expansion
• High isotropic behavior (smallest delta between parallel and vertical CLTE)

Environmental benefits

• Fully RoHS compliant
• Entirely halogen free
• No red phosphorous
• Designed for lead free electronics

 

 

Strength and chemical resistance

• High mechanical toughness
• High weld line strength
• High stiffness
• Resistance to abrasion and chemicals
• High pin insertion and retention force

Electrical performance

• CTI of 600V
• Low and stable dielectric constant
• Low Ag migration (low moisture/ionic impurities)
• High dielectric strength

Ease of processing

• Good flow (highest flow among any halogen free poylamide, comparable to high flow Stanyl)
• Low outgassing
• Low mold deposit
• Low screw & barrel corrosion
• High thermal stability
• Fast crystallization rate
• Low mold temperature with water cooled molds possible

Flammability rating

• UL 94-V0 down to 0.2mm
• Stanyl ForTii supports IEC 60335-1 (plaques GWFI=960°C, GWIT>800°C)