InnovationsMeeting market demands with innovative solutionsIn 2007 DSM extended their portfolio with the introduction of Stanyl® ForTii™ directed towards trends for miniaturization and convergence of electronic devices like cell phones and computers– addressing market needs via smart innovation.
Inspired? Intrigued? Can you help?If you have an interesting idea or want to initiate a conversation visit our Open Innovation Platform! |
Laser Direct Structuring (LDS)LDS technology drives fast innovation as compared to other molded interconnect device (MID) technologies by allowing on-the-fly changes in a prototype phase & multiple configurations in production components while incurring little or no additional tooling costs. This gets your product to an optimal solution and to the market faster than your competitor AND with flexibility of added features down the road. Stanyl ForTii delivers performance for SMT RAST connectorsStocko, a leading European manufacturer of electro-mechanical components, switched all their SMT RAST connectors to Stanyl® ForTii™. The unique properties of Stanyl ForTii in this application include its reflow soldering ability, which is better than PPA, very high pin retention values, which are better than LCPs, stable and fast processing, very good electrical properties (CTI 600V), low moisture uptake, and proven lower corrosion on molding equipment compared with competitive products. In addition, the halogen-free V-0 material passes the Glow Wire Test on end products according to IEC 60335-1. |
