Innovations

Meeting market demands with innovative solutions

In 2007 DSM extended their portfolio with the introduction of Stanyl® ForTii™ which answers trends for miniaturization and convergence of electronic devices like cell phones and computers– addressing market needs via smart innovation.

Stanyl ForTii delivers performance for SMT RAST connectors
Stocko, a leading European manufacturer of electro-mechanical components, switched all their SMT RAST connectors to Stanyl® ForTii™. The unique properties of Stanyl ForTii in this application include its reflow soldering ability, which is better than PPA, very high pin retention values, which are better than LCPs, stable and fast processing, very good electrical properties (CTI 600V), low moisture uptake, and proven lower corrosion on molding equipment compared with competitive products. In addition, the halogen-free V-0 material passes the Glow Wire Test on end products according to IEC 60335-1.

Laser Direct Structuring (LDS)
The innovative LDS technology gives higher flexibility compared to other molded interconnect device (MID) technologies, providing faster time to market

Simple laser programming changes enable fast development cycles, fine tuning and optional product offerings.
Single material – two-shot molding not required, which simplify's the molding process and reduces material inventory
Enables 3D shapes and electrical connections simultaneously
Suitable for relatively small surface area
Only three process steps – molding, laser processing, metallization

Stanyl ForTii enable Micromolded 3D packages to integrate semiconductors and magnetics
NXP, previously known as Philips Semiconductors, is a globally leading semiconductor manufacturer active in the areas of Consumer, Automotive, Security, RFID, Multimarket ICs and Discretes. In a co-development, we have recently shown the world’s smallest MEMS package integrating a Semiconductor and Magnet for EMI filtering and ESD protection. This design was only possible through the use of Stanyl ForTii to micro mold the housing and all its tiny structure combined with Laser Direct Structuring to replace the PCB. This concept not only pushes miniaturization to a maximum, but also offers a viable alternative for applications, where other MID techniques are limited in cost due to medium to low production units or simply not possible if the designs are too small.