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DSM in Electrical & Electronics

ForTii for DDR connectors

The DDR3 is a well-established and mainstream interface technology for computer random access memory modules, but the move from DDR3 to DDR4, the latest type of synchronous dynamic random-access memory, is started.

DSM’s ForTii gives customers an opportunity to reconsider their designs and material choices for DDR connectors  as ForTii meet all the high demanding requirements  and is in addition, suitable for wave- and reflow soldering.

The use of DDR-DIMM sockets in blade servers continues to increase, putting greater demands on components. ForTii enables DDR3 manufacturers to produce applications with reduced weight and height, enabling easy rework at lower temperature loads, with fewer heat traps and better thermal airflow.

Because of the material’s excellent stiffness and high deflection temperature under load (HDT), the warpage of ForTii connectors after reflow soldering to the PCB is better than any Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs).

Furthermore, ForTii  is is entirely halogen and red-phosphorous free.

The result: A solution that benefits people, planet and profit.

DDR4 will provide computers with significantly improved power management and increased speed and performance. This directly impacts the requirements for mechanical strength, pin retention force and flow.

You know why OEMs select ForTii for DDR4?

ForTii has significant advantages  compared with liquid crystal polymers (LCPs) and polyphthalamides (PPAs), which are also tested for the application. The long form factor of the connectors, and the multi-cavity design of the injection mold, demanded a high flowing material. No halogen-free PPA can match the flow levels of ForTii. 

To achieve good co-planarity of the connector on the FR4 printed circuit board (PCB), there also had to be a close match in CLTE (coefficient of linear thermal expansion) between the FR4 and the connector housing material; ForTii provides this. In addition, it has a unique combination of high stiffness and high deflection temperature under load (HDT). As a result, warpage of ForTii connectors after reflow soldering to PCBs is better than any LCP or PPA. 

Download the full paper and learn all about:

  • The development of various halogen-free DDR4 connectors.
  • The key performance parameters on the various DDR4 connector housings.
  • A comparison between various high performance polymers such as LCP, Fortii (PA4T), and different PPA’s on the key parameters such as connector reliability, pin retention forces, warpage, and CLTE compatibility with the PCB.

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