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DSM in Electrical & Electronics

Stanyl® and ForTii® for DDR connectors

Electronics industry trends like miniaturization, integration and “thinnovation” - combined with the move towards Cloud Computing – will ensure that the server market will depend increasingly on reflow soldering assembly technology. The required power supplies to drive each of these systems can easily reach 500V or more, and so plastic materials used in these server systems will need to meet stringent electrical, thermal and mechanical criteria. DSM’s ForTii® meets these needs, delivering exceptionally high – and balanced – performance.

One proven example is ForTii for DDR connectors, where the material excels in stiffness and high deflection temperature under load (HDT). Moreover, the warpage of ForTii connectors after reflow soldering to the PCB is better than any Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs).

The use of DDR-DIMM sockets in blade servers continues to increase, putting greater demands on components. ForTii enables DDR3 manufacturers to produce applications with reduced weight and height, enabling easy rework at lower temperature loads, with fewer heat traps and better thermal airflow.

Because of the material’s excellent stiffness and high deflection temperature under load (HDT), the warpage of ForTii connectors after reflow soldering to the PCB is better than any Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs).

Furthermore, ForTii  is is entirely halogen and red-phosphorous free.

The result: A solution that benefits people, planet and profit.

DDR4 will provide computers with significantly improved power management and increased speed and performance. This directly impacts the requirements for mechanical strength, pin retention force and flow.

You know why OEMs select ForTii for DDR4?

ForTii has significant advantages  compared with liquid crystal polymers (LCPs) and polyphthalamides (PPAs), which are also tested for the application. The long form factor of the connectors, and the multi-cavity design of the injection mold, demanded a high flowing material. No halogen-free PPA can match the flow levels of ForTii. 

To achieve good co-planarity of the connector on the FR4 printed circuit board (PCB), there also had to be a close match in CLTE (coefficient of linear thermal expansion) between the FR4 and the connector housing material; ForTii provides this. In addition, it has a unique combination of high stiffness and high deflection temperature under load (HDT). As a result, warpage of ForTii connectors after reflow soldering to PCBs is better than any LCP or PPA. 

Download the full paper and learn all about:

  • The development of various halogen-free DDR4 connectors.
  • The key performance parameters on the various DDR4 connector housings.
  • A comparison between various high performance polymers such as LCP, Fortii (PA4T), and different PPA’s on the key parameters such as connector reliability, pin retention forces, warpage, and CLTE compatibility with the PCB.

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