Laser Direct Structuring: Meeting the heat
LDS technology drives fast innovation in comparison to other molded interconnect device (MID) technologies by allowing on-the-fly changes at the prototype phase along with multiple configurations in production components – and all while incurring little or no additional tooling costs. It all adds up to a great competitive advantage.
High temperature LDS designs really start to make a difference when driving the integration and miniaturisation of various component functions.
The plated areas can have multiple, combined or mixed functions, for example in E&E conductive tracks or thermal management through tracks or surfaces. This also includes mechanical functions by plated areas and visible queues & aesthetics (except operational symbols & logos).
The best balanced material
ForTii is the best balanced material for applications where high temperature (reflow) and mechanical performance are needed. Take a look.
ForTii offers you outstanding performance across all steps of the LDS manufacturing process.
It offers good molding for small parts with high flowalong with a wide processing window for lasering. This is coupled with a high plating index for easy playing and excellent peel strength and overall good adhesion.
From the very beginning, ForTii has been developed in close partnership with our industry partners - and that work continues in the field of LDS. We work with several partners across all LDS-related disciplines, specifically…
The Research Association for Molded Interconnect Devices 3-D MID (based in Germany), highly respected and very closely connected to the evolving needs of the industry.
LPKF Laser & Electronics AG, a leading manufacturer of machines and laser systems used in electronics fabrication, medical technology and automotive. Also based in Germany, the company has a very strong focus on research and development.