ForTii for DD3 and DDD4 connectors
LOTES selects ForTii for DDR4
The new DDR4 family of connectors from LOTES meets OEM design needs across a range of devices, including servers, desktops, and voice gateways. By using high-flow ForTii, LOTES has been able to design long-form connectors using multi-cavity injection molding techniques.
Because of the material’s excellent stiffness and high deflection temperature under load (HDT), the warpage of ForTii connectors after reflow soldering to the PCB is better than any Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs).
Furthermore, ForTii is is entirely halogen and red-phosphorous free.
ForTii for DDR3 functionality
ForTii is also proving to be a perfect fit for the next generation of demanding DDR3 connectors thanks to its high flow, low warpage after reflow, excellent reflow after soldering – and outstanding pin retention.
The use of DDR-DIMM sockets in blade servers continues to increase, putting greater demands on components. ForTii enables DDR3 manufacturers to produce applications with reduced weight and height, enabling easy rework at lower temperature loads, with fewer heat traps and better thermal airflow.
The result: A solution that benefits people, planet and profit.