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ForTii®

ForTii: Engineering the casings

ForTii® is proving ideal for (notebook) casings designers in the E&E industry thanks to its stiffness, impact resistance and flame retardance.
PDA laying on a laptop keyboard

One of the industry’s biggest challenges is that as mechanical requirements increase, traditional PC/ABS materials simply don’t have the stiffness and strength to cope with demanding applications like the enclosure.

ForTii meets this demand for thinner devices that requires strong frames and housings, replacing not only metals (magnesium and aluminum) but also higher performing plastics. How? By delivering on stiffness requirements while maintaining impact strength – as well as UL94 V0 flammability requirements, even for thinnest of walls.

How does ForTii measure up?

Compared to metals, the weight is lower against competitive (lower) cost.

Versus plastic (VS PC/ABS) ForTii provides:

  • Thickness reduction
  • Higher stiffness
  • Flame retardance
  • A lower carbon footprint.

Versus metals, ForTii provides:

  • Cost Saving through process reductions
  • Flexibility in design
  • Longer tool life.