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ForTii®

ForTii in sensors – making sense

Our ForTii® thermoplastics help you design and manufacture overmolded components and sensors more efficiently by replacing traditional machined-metal, multi-part, automotive sensor components like transmission speed sensors and oil level sensors.
Close-up of male hand holding a car sensor

Sensors in general and MEMS in particular are key components in many electronic interfaces. They manage internal and external controls and demand the most extreme performance requirements – hence the need for equally high performance materials.

Specifically, overmolded components like solenoids and sensors need materials that cope with fierce temperatures, and can be processed at low pressure - thus avoiding displacement of the electronic components. With its excellent creep resistance, ForTii meets this need. It’s proven to withstand the highest temperatures long term, dealing with extreme peaks while also withstanding aggressive ATF oils.

ForTii also meets temperature cycle tests, vibration tests at various temperatures, and long-term tests for the maintainance of a good seal against ingress of air, oil, dust, and water at elevated pressures and temperatures.

The material offers cost reductions through the ability to consolidate parts – in fact ForTii outperforms traditional materials like PPS, PPA and LCP - not only as a package material but also with Laser Direct Structuring.

This innovative technology enables the entire PCB and driving circuitry to be integrated straight into the sensor; which in turn means smaller components with more functionality – and reliability. Warpage and delamination are a thing of the past thanks to ForTii’s mechanical, thermal and adhesion (sealing) ability.

Material benefits

Specifically, ForTii provides:

  • Low warpage;
  • Excellent sealing between package and lead frame thanks to very high adhesion;
  • Lead free SMT soldering (260ºC);
  • Halogen free flame retardant V-0 @ 0,2mm;
  • High temperature performance;
  • High mechanical strength, outperforming LCPs;
  • Good adhesion to metals (no silicone encapsulation needed) outperforming LCPs;
  • High elongation at break.