Solving the soldering challenge
Lead-free soldering is fast becoming an industry standard in the wake of ever-growing pressure to reduce harmful substances from the production process and producer greener products,. The big issue of course is warpage and finding a material able to cope with the increased heat and maintain its overall stiffness and durability.
ForTii solves this challenge thanks to its combination of high melt temperature (325°C) and low moisture absorption – all of which means that ForTii grades perform very well in SMT applications up to peak temperatures of 288°C.
Deformation is minimal and ForTii makes it far easier for designers to predict the warpage.