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DSM’s Stanyl ForTii proven for next generation DDR-DIMM sockets

Singapore, SG, 22 Jul 2013 11:00 CEST

Royal DSM, the global Life Sciences and Materials Sciences company, says its Stanyl® ForTii™ is the only halogen free, high temperature polyamide that answers the stringent requirements of reflow soldering for DDR3sockets, as well as the demand for high flow. It also offers extremely low warpage after reflow.
An ultra-low profile DDR-DIMM socket

The DDR3 is a well-established and mainstream interface technology for computer random access memory modules. The modules can transfer data at speeds of between 800 and 1600Mbps and operating frequencies of 400 to 800 MHz, which is twice the speed of the previous generation of modules, DDR2. 

Major OEMs have started to use DDR-DIMM sockets in the latest generation of blade servers, which put a new and more challenging set of demands on components, owing to their new chassis design, thermal, power and airflow conditions. They require components with low height, for example, to compensate for the use of dual in-line memory modules incorporating a higher number of chips (high density DIMMs). Low component height and less “real estate” allow easy rework at lower temperature loads, create fewer heat traps, and provide better thermal airflow.

The new servers also need less PCB keep-out area, enabling higher component density due to reduced latch-actuation angles. In addition, specifiers demand plastics that are entirely free of flame retardants that are halogenated and/or contain red phosphorous. Furthermore, they want to use different colors for housings and latches, to provide DDR-DIMM socket differentiation.

Sockets made with Stanyl ForTii meet all these conditions. In addition, they are suitable for wave- and reflow soldering. 

The long form factor of the sockets, together with possible mismatch in coefficient of linear thermal expansion (CLTE) between FR4 (glass-reinforced epoxy laminate) PCBs and the housing material, presents a high risk of system warpage, making the challenge for any ULP (Ultra Low Profile) or VLP (Very Low Profile) socket material particularly severe. DSM’s Stanyl ForTii has been selected for a new generation of ULP DDR3 sockets after tests were carried out on it alongside various liquid crystal polymers (LCPs) and polyphthalamides (PPAs).

Stanyl ForTii is part of a unique portfolio of high temperature materials with high flow. With this portfolio, combined with in-house technologies on halogen free flame retardants and solutions for lead-free soldering, DSM is contributing to finding a solution to the growing problem of e-waste, helping foster recycling initiatives and delivering environmental, health and safety improvements. 

Siang-Hock Quah, Regional Manager South East Asia at DSM, comments: “Stanyl ForTii gives customers an opportunity to reconsider their designs and material choices. It expands the application range of DSM to applications with reflow surface mount technology, and will help customers to achieve higher performance in their applications and meet current and upcoming requirements of original equipment manufacturer.”

DSM Global Marketing Director, Electronics, Tamim Sidiki says that with Stanyl ForTii and its halogen and red phosphorous free, flame retardant grades, “We extend todays’ coverage of Stanyl into most demanding reflow soldering applications. Stanyl ForTii is the only halogen free, high temperature polyamide that supports customers in meeting stringent requirements of reflow soldering and also in their demand for high flow and extremely low warpage after reflow. Furthermore, Stanyl ForTii offers very high pin retention forces, making the material a strong candidate for the upcoming DDR3 generations.”