As connectors become smaller there are more weld lines and stresses are localized in these miniature products, potentially causing crack issues. Reducing the PCB footprint is now critical, and in harsh environments, fulfilled reflow soldering and robust mechanical performance will be important to materials selection in electronic components and connectors. A material with good balance of toughness and stiffness is necessary to allow engineers to minimize the risk of cracking due to improved strength of the weld line.
Also, the following requirements for connectors must be met for safe and reliable operation during use of the car and throughout the manufacture of parts through the various tier processes:
- Unlimited shelf life (JEDEC MSL1)
- No pin corrosion (insulation material is free from halogens and red phosphorous and without iconic heat stabilizers)
- High continuous use temperature of 150-180°C
- Excellent chemical resistance
- High ductility
- High electric strength and CTI of 600V and above (PLC0)
DSM’s ForTii product line addresses all these requirements. ForTii JTX2 and JTX8 combine the dimensional stability and low moisture absorption of polyesters with the high mechanical strength of polyamides. ForTii JTX8 is the only material that meets JEDEC MSL1 and ensures zero blistering over an infinite shelf life. Also, it ensures excellent reliability during and after assembly as well as after years of use in harsh conditions. Free from halogen, red phosphorous, and ionic heat stabilizers, these ForTii grades are sustainable.
To learn more about the characteristics of ForTii JTX2 and JTX8 contact us for additional information. You can also visit plasticsfinder.com for additional information about ForTii, including technical data sheets.