So, we did a mechanical test looking at the insertion force/extraction force; durability of insertion/extraction cycles (minimum 10,000 times); cable flexing; cable pull out; four-axis continuity test; and wrenching strength of different materials.
We found that materials used for Virtual Link connectors need to have the following requirements:
- High flow, capable for 0.1mm wall thickness design
- High stiffness, toughness and weldline strength
- High retention force between contacts and plastic housing
- High wear resistance (>10,000 times mating/unmating durability test)
- Good process window, capable for second insert molding
- Halogen free UL94-V0 and high CTI to support USB PD 2.0 and 3.0 standard (up to 54 Watt power)
- Good colorability to support consumer electronics market needs
- Lead free reflow soldering without blistering
- Compatible with high speed signal transfer up to 20 Gbps
Regarding Virtual Link receptacles, there can be a concern about blistering. A very important factor of blistering is wall thickness, but there is no risk for blistering if the wall thicknesses in the tips are all below 0.2mm. Also, all wall thickness is usually in the back-seat, which is above 0.8mm, hence, an extremely low risk for blistering.
For various OEMs, we have a 1kt track record of the Stanyl grades used in Type C connectors, and no blistering complaints were ever received about USB-C type connectors. Plus, Stanyl has a high CTI and fails only after more than two times the number of salt solution droplets compared to low CTI LCP during the CTI test.
In real USB Type C application environments, an insulator with a high CTI can tolerate much higher voltage or much higher contamination levels. Thus, product reliability of a critical charging interface, such as USB Type C, is significantly increased by using a high CTI insulation material.
To learn more about Stanyl grades, or to request test samples, contact us or visit plasticsfinder.com for additional information, including technical data sheets.