The trend of needing more design freedom is driving more integration across the electronics industry. One solution shows promise—the integration of electronic functionality into plastic parts. One of the main ways this is done is through Laser Direct Structuring (LDS), which prints conductive traces on a 3D plastic part. An example of this is printing an antenna onto the frame of a mobile phone.
Performance during use is essential, yet we must look at the challenges posed by production processes. Achieving electronic integration can expose materials to peak temperatures above 260°C in processes like reflow soldering. When we develop different material grades, we must consider both the production of the part, and its performance in the application.
Our ForTii® product line is a proven polyphthalamide (PPA) material that meets the demands of these ever-evolving industries. ForTii demonstrates excellent mechanical properties over a wide temperature range, with good chemical stability, and peak temperature resistance that has set the benchmark across the industry. The material is preferred for use in SMT connectors that go through reflow soldering.
For LDS part production, three characteristics are key to success:
- Plating index
- Design freedom
Our portfolio of LDS grades of ForTii delivers a consistently high plating index for fast and reliable processing, superior adhesion that ensures the integrity of the 3D circuitry, and tight weldlines with very high resolution to ensure design freedom while maintaining the quality of the circuitry design. Plastic PCBs boost design flexibility and cut manufacturing cost.