Decrease fire risks when using higher CTI rated material for improved performance
Liquid crystal polymer (LCP) has long been used to manufacture micro-USB connectors. However, this material demonstrates low resistance to tracking when applied to electronics with thin walls and reduced pitch. To minimize the risk of accidents that can lead to costly recalls, manufacturers have shifted to PPA for improved safety performance. As USB-C connectors move to higher power throughputs, they need to consider materials with even better safety profiles for this application.
DSM’s ForTii is a best-in-class PPA with high amide density, engineered for demanding electrical and electronic applications. With its outstanding thermal and electrical properties, processing characteristics, and creep resistance, the material offers:
600V comparative tracking index (CTI) to reduce tracking by 50% in thin-walled parts
- Certified halogen-free UL94 V-0 grades
- High dimensional stability with low warpage
- High flow required for walls as thin as 0.1mm
- Compatible with high-speed signal transfer up to 20Gbps
- Lead-free reflow soldering without blistering
- Level 1 JEDEC moisture sensitivity level (MSL) blistering resistance for USB-C applications
- Halogen and red phosphorous-free grades
For standard USB connectors that don’t need to meet the PLC 0 CTI rating at 240W power, our Stanyl® PA46 material provides excellent mechanical strength, and the best cost-performance balance.
Our team tested how effectively Stanyl withstands tracking compared to LCP. We ran electric currents through connectors made from both materials, and continuously applied saltwater droplets to each. The LCP connector failed after being exposed to 12 droplets, while the insulating plastic in our Stanyl alternative remain undamaged after 60 droplets were applied.
DSM continues to optimize our material solutions for manufacturing next-generation electronics that process higher power levels and meet thinnovation trends. With more than 300 million USB-C connectors made from our materials on the market today, we’re prepared to partner with you through every stage of developing electronic devices that give your customers peace of mind, outperform the competition, and help you drive new business.