PA4T PPA - ForTii®
ForTii has a unique PPA's technology with high amide density. The ForTii platform includes polymers that are the highest crystalline, highest melting point and highest glass transition temperature amongst all PPA.
Increasing connectivity and cloud computing is placing higher demands on servers. As data rates increase, higher speeds and more bandwidth require connectors and sockets with higher pin counts. At the same time, the industry is looking to reduce energy consumption substantially, like the recently introduced DDR4 memory, which increases performance by up to 50% while decreasing the voltage and power draw of the overall computing system.
Our high-performance engineering plastics are ideal for applications like DDR4 DIMM connectors, enabling easy rework at lower temperature loads. For USB-C connectors, we’re enabling thinner walls with a more reliable connection.
Our team of experts work together with key industry partners to find the best solutions for today’s challenges, as well as the next-generation DDR5 DIMM connectors.
ForTii has a unique PPA's technology with high amide density. The ForTii platform includes polymers that are the highest crystalline, highest melting point and highest glass transition temperature amongst all PPA.
Integrated electronics, a revolutionary technology to put electronics in plastics. They enable cars to be lighter and safer, electronics to be more functional and comfortable. They make our lives more comfortable.
DSM is your partner for integrated electronics, today and tomorrow. With proven solutions, a portfolio of LDS materials, expertise and processing knowledge, we are ready for your challenge.
ForTii: The best fit for DDR4 housings
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