PA4T PPA - ForTii®
ForTii has a unique PPA's technology with high amide density. The ForTii platform includes polymers that are the highest crystalline, highest melting point and highest glass transition temperature amongst all PPA.
Mobile devices have changed the way we find information, entertain ourselves, and remain connected to our friends and family. As devices evolve to help us manage more aspects of our lives, they demand more from the materials used to make them.
Our solutions, combined with our team of experts, empower you to define the next generation of mobile electronics. Our unique materials enable cutting-edge design, higher performance, and the ability to unlock the full potential of the Internet of Things (IoT), while also reaching targets for safety and sustainability.
Whether it’s for connectors, cables, frames or antennas, the world’s leading mobile device manufacturers rely on our materials to enable thinner and lighter components that are safer and more reliable.
ForTii has a unique PPA's technology with high amide density. The ForTii platform includes polymers that are the highest crystalline, highest melting point and highest glass transition temperature amongst all PPA.
Arnitel is a high-performance ThermoPlastic Copolyester (TPC) that offers you a unique combination of flexibility, high temperature resistance and strength - plus excellent processing characteristics.
ForTii, a high-performance polyamide, from DSM, is being used in the frame splitters of Xiaomi Mi4. Xiaomi Technology Co., Ltd., is a highly innovative enterprise specializing in smartphone production in China. Because of its perfect mechanical performance, incomparable high flowability, excellent color stability, superb chemical resistance and DSM R & D team's strong technical support, Xiaomi selected the material.
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