As our economy places more focus on efficiency, industry is responding by creating products that are thinner, lighter, and smaller – with the same or more functionality. This trend is playing out in the automotive industry, as OEMs work hard to achieve stringent government fuel consumption goals, as well as in the electronics industry, as we see each smartphone generation become an average of 12% thinner than the generation before.
Developing smaller parts and components creates challenges across the value chain. It places bigger demands on the materials used for fabrication, pushes designers to replicate functionality in a new material or integrate multiple functions into one part, and changes the production process completely. At DSM, we see these challenges as opportunities.
This is what drives us to continuously develop new material grades that meet specific customer requirements. Whether it’s a material that enables functional integration, or one that can meet performance requirements in a thinner-walled design, our broad portfolio of materials has a solution that enables you to design smaller parts that achieve efficiencies in component count, space, height and cost.
Stanyl ForTii has the proven high performance and high flow grades to meet demanding applications like SMT connectors. Technologies like Laser-Direct-Structuring (LDS) can also be incorporated, allowing integration of electronic functionality in thin-walled 3D injection molded plastic parts, further reducing the part’s size and complexity.
Ask us how we can help you achieve your downsizing goals.