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DSM in Electrical & Electronics

Memory module connectors

The market for Memory Module Connectors (MMCs) is growing fast as consumers crave devices with greater functionality. These intricate components are getting more challenged by the introduction of halogen free requirements. Our Stanyl® and ForTii® polyamide 46 materials are superior in many respects to Liquid Crystal Polymer here (including warpage due to CLTE mismatch.
Close-up of female hand holding a Memory Module Connector; 2 other MMC laying on the table in front of hand

Our Stanyl and ForTii are ideal for memory module connectors thanks to their high-heat resistance, offering a unique balance of high stiffness and good flow.

These unique performance materials are also helping manufacturers respond to trends for increased miniaturization (and therefore complexity) inside electronic devices – while also providing a more sustainable (non-halogen) alternative to traditional materials like Liquid Crystal Polymer (LCP).

Greater warp resistance

Stanyl and ForTii also have what it takes to meet stringent functional requirements. Halogen free requirements bring another challenge to connector manufacturers producing memory module connectors; meanwhile there’s the problem of warpage in PCB and connectors – which leads to high stress on the solder joint, particularly for long connectors such as DDR DIMM connectors.

Stanyl and ForTii ensure that the warpage is as far below the allowed level as possible – a major benefit for connector manufacturers and OEMs.