ForTii offers you a unique balance of properties including excellent dimensional stability, compatability with lead free reflow soldering, and the highest stiffness and mechanical strength at extreme temperatures.
Register now for this free 30-minute webinar on Thursday, September 20, 2018 and learn which metal components can be replaced with plastics. Presenter: Tim Vorage, Global Market Development Manager, DSM Engineering Plastics.
ForTii® helps meet the defining trends in automotive electrical and electronics (E&E): Mass reduction for cost savings, increased miniaturization, design flexibility, and better heat management.
Our ForTii® thermoplastic addresses market trends for miniaturization and convergence of electronic devices like cell phones and computers. It offers performance benefits simply unmatched by traditional materials…
ForTii® - PA4T/PPA
The PPA with POWER
ForTii is a breakthrough high temperature polyamide with heat stabilized and halogen-free flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. We developed the ForTii E&E portfolio in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
The ForTii MX metal replacement portfolio enables engineers and designers to realize structural parts with robust part performance over a large temperature range and in aggressive environments (road salt, battery acid, coolants, mineral oil). That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
It’s all in the application…
ForTii product information
ForTii is a breakthrough high temperature polyamide with halogen-free flame retardant grades for a range of demanding applications.
Discover its properties, processing characteristics - and of course the different grades we offer…
ForTii® offers excellent performance when used in injection molding. It gives you better processing with a high flow, suitable for thin-wall molding and applications with demanding designs.
We already offer a wide portfolio of ForTii grades – with more to come. Our portfolio includes both (halogen-free) flame retardant and non-flame retardant grades for both E&E and automotive markets.
Laser Direct Structuring
As miniaturization and convergence continue to drive the electronics industry, so Laser Direct Structuring (LDS) grows in popularity by enabling smaller designs with integrated functionalities.
Lead free compatibility
The days of lead-based products are clearly numbered. Even in segments where lead isn’t yet prohibited…it soon will be.
DD3 and DDD4 connectors
The next generation of DDR4 memory connectors from leading Taiwanese manufacturer LOTES has been built using our own ForTii® H11 polyamide 4T for the all-important housing.
Our ForTii® polyamide 4T is now being used by leading Swiss electronics specialist Cicor in its next generation of three dimension molded interconnect devices (3D-MIDs) for safeguarding data security in the banking industry.
Heat management is critical for terminal blocks. How can you minimize creep at high voltage and thus get the very best from your application while managing costs? The answer is ForTii®- our unique polyamide 4T that’s strong, safe and sustainable.
ForTii® is entirely halogen free, which makes it perfectly suited to the growing need in the consumer electronics industry for materials that are safe and sustainable.
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