DSM Engineering Plastics


Dimensional stability

ForTii combines low moisture absorption with low thermal expansion.

Dimensional stability

Taking shape: Dimensional stability

ForTii® has both low moisture absorption and a low Coefficient of Thermal Linear Expansion (CTLE) – which gives it great dimensional stability and very low warpage – ideal for lead-free Solder Mount Technology (SMT). ForTii has one of the lowest moisture absorption rates of all semi-aromatic polyamides.

Lower warpage

Warpage is a serious problem for designers – and it’s the mismatch in the CTLE at both parallel and perpendicular angles that is the major cause of it in the end part of the component. By using ForTii you close this gap and outperform traditional LCP solutions through highly stable applications that remain flat even after reflow soldering.

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